An Aggregated Optimization Model for Multi-Head SMD Placements

Research output: Working paperDiscussion paperOther research output

501 Downloads (Pure)


In this article we propose an aggregate optimization approach by formulating the multi-head SMD placement optimization problem into a mixed integer program (MIP) with the variables based on batches of components. This MIP is tractable and effective in balancing workload among placement heads, minimizing the number of nozzle exchanges, and improving handling class. The handling class which specifies the traveling speed of the robot arm, to the best of our knowledge, has been for the first time incorporated in an optimization model. While the MIP produces an optimal planning for batches of components, a new sequencing heuristics is developed in order to determine the final sequence of component placements based on the outputs of the MIP. This two-stage approach guarantees a good feasible solution to the multi-head SMD placement optimization problem. The computational performance is examined using real industrial data.
Original languageEnglish
Place of PublicationTilburg
PublisherOperations research
Number of pages18
Publication statusPublished - 2010

Publication series

NameCentER Discussion Paper


  • Multi-head surface mounting device
  • Component placement
  • Variable placement speed


Dive into the research topics of 'An Aggregated Optimization Model for Multi-Head SMD Placements'. Together they form a unique fingerprint.

Cite this