Improving Temperature Prediction Accuracy Using Kalman and Particle Filtering Methods

Baver Ozceylan*, Boudewijn R. Haverkort, Maurits De Graaf, Marco E.T. Gerards

*Corresponding author for this work

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    3 Citations (Scopus)
    109 Downloads (Pure)

    Abstract

    Predicting the device temperature is crucial for high performance mobile devices since a high temperature reduces the device reliability and lifetime, and increases the power dissipation per processing activity. For these reasons, thermal models are used to predict the temperature and schedule the workloads according to these predictions. This means that more accurate predictions can improve the reliability, lifetime and energy-efficiency of devices. We introduce two different generic methods to extend a thermal model to improve the prediction accuracy. The first method is to extend a thermal model with a Kalman filter. This approach enables a device to adapt to environmental changes more easily and to reduce the effect of noise by combining sensor data and dynamic behavior of the system. However, it assumes every random variable to be normally distributed. The second method is to extend a thermal model with a particle filter. In addition to the ability of adapting better to environmental changes, this approach enables a device to approximate any arbitrary distribution to reduce the effect of noise. Both methods are applicable to any dynamic thermal model to improve its prediction accuracy. Our experimental results show that the new methods indeed improve the prediction accuracy.

    Original languageEnglish
    Title of host publication2020 26th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2020 - Proceedings
    PublisherInstitute of Electrical and Electronics Engineers Inc.
    ISBN (Electronic)9781728176437
    DOIs
    Publication statusPublished - 14 Sept 2020
    Event26th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2020 - Virtual, Berlin, Germany
    Duration: 14 Sept 20209 Oct 2020

    Publication series

    Name2020 26th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2020 - Proceedings

    Conference

    Conference26th International Workshop on Thermal Investigations of ICs and Systems, THERMINIC 2020
    Country/TerritoryGermany
    CityVirtual, Berlin
    Period14/09/209/10/20

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